GW1458HF
Low-warpage, high-flow grade of polyamide 9T (PA9T) reinforced with 45% glass fiber. It offers excellent heat resistance, high strength, low water absorption, and reflow soldering resistance, making it suitable for connectors, switches, and other electrical and electronic applications.
Low warpage
High flow
HB
Halogen-free
Application examples
Property table
| Unit | Test method | Value | |
|---|---|---|---|
| Grade name | GW1458HF | ||
| Glass fiber content | ％ | ― | 45 |
/
Physical properties
| Specific gravity | - | ISO 1183 | 1.50 |
| Water absorption (23°C, immersed in water for 24hrs) | ％ | ISO 62 | 0.12 |
/
Mechanical properties
| Tensile strength | MPa | ISO 527 | 152 |
| Flexural strength | MPa | ISO 178 | 242 |
| Flexural modulus | GPa | ISO 178 | 12.8 |
| Charpy notched impact strength | kJ/m2 | ISO 179/1eA | 16.7 |
/
Thermal properties
| Melting point | °C | ISO 11357-3 | 306 |
/
Dimensional properties
| Mold shrinkage (2 mmt), flow direction | ％ | ISO 294-4 | 0.2 |
| Mold shrinkage (2 mmt), transverse direction | ％ | ISO 294-4 | 0.7 |
/
*The above data are property values measured in the absolutely dry state.
*The above data are actual measured values obtained by our company and are not guaranteed values.
* "Halogen free" indicates less than 900-ppm Br, less than 900-ppm CI, and less than 1500-ppm total halogen content (BR, CI)
